The ChipMOS Design Center offers reliable, fast turn around and cost-effective design services to meet volume manufacturing and customer requirements. Our Design Center is equipped with the latest commercial and self-developed design software and staffed with experienced employees, enabling us to service our customers and meet their various package design requirements.
Services of the Design Center include:
- IC package design with metal leadframe and laminate substrate.
- COF package design
- Package property simulation and characterization, such as: Thermal, electrical, thermal-mechanical, … etc.
The ChipMOS Design Center ensures the success of your product development. A larger library of available package outlines, leadframe/laminate and trays selections allow you to shorten the development cycle time and minimize the need for tool review and discussion. Please contact your ChipMOS account manager to get started.